What is Physical Vapour Deposition?

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Multiple Choice

What is Physical Vapour Deposition?

Explanation:
Physical Vapour Deposition is about forming a thin, uniform film on a surface by transferring material from a source as a vapor and letting it condense on the workpiece. In practice this often means evaporating the coating material in a vacuum so its vapor travels to the substrate and deposits as a thin film. This matches the idea of coating an object with a thin film via evaporation and condensation. The other options describe different processes: removing material (etching), applying a thick paint by brush (not a vapor-deposited film), or describe sputtering as the action of bombarding a surface with ions. While sputtering is a way to achieve PVD, the fundamental description of Physical Vapour Deposition is the vapor-to-film coating via evaporation and condensation.

Physical Vapour Deposition is about forming a thin, uniform film on a surface by transferring material from a source as a vapor and letting it condense on the workpiece. In practice this often means evaporating the coating material in a vacuum so its vapor travels to the substrate and deposits as a thin film. This matches the idea of coating an object with a thin film via evaporation and condensation.

The other options describe different processes: removing material (etching), applying a thick paint by brush (not a vapor-deposited film), or describe sputtering as the action of bombarding a surface with ions. While sputtering is a way to achieve PVD, the fundamental description of Physical Vapour Deposition is the vapor-to-film coating via evaporation and condensation.

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